Home
:Categories
:PCB Assembly Cleaners
:Eco-Stencil UM

Eco-Stencil UM

Water-based, nonflammable manual & under stencil cleaner

Request A Sample

Part #	Name	Size	Units Per Case	Price Per Case	Case Qty
1570-100DSP	Eco-Stencil UM Wipes	100 ct	6	$144.54
1570-QT	Eco-Stencil UM - 1 qt	1 qt (0.95L)	12	$213.60

Packaging Order minimum case quantity only. Extra shipping fees may apply.

Order from an authorized distributor

Effectively removes all types of solder paste (e.g. waterbased, RMA, noclean, leadfree) and uncured adhesive from screens, misprinted boards and equipment. Completely safe on stencils, squeegees, and equipment surfaces. Ideal replacement for IPA cleaners, which are often prohibited because of safety and environmental restrictions on VOC emissions or waste disposal issues.

Features & Benefits

Quickly clean paste or uncured adhesive
Safe for stencils, tools, misprinted boards
Nonflammable
Low VOC, zero GWP
Non-ozone depleting
Compatible with DEK Nano-ProTek coating

Applications

Manual stencil tool, work surface, and squeegee cleaning
Automatic underside wipe stencil cleaning
Batch ultrasonic cleaning
Removes unsoldered leaded & lead-free solder pastes
Cleans off uncured adhesives

Applications

FAQ's

How do I figure out the shelf life of a product?

The shelf life of a product can be found on either the technical data sheet (TDS), available on the product page, or by looking on the certificate on conformance (COC). The COC can be downloaded by going to https://www.techspray.com/coc. Once you have the shelf life, you will need to add it to the manufacture date for a use-by date. The manufacture date can be identified by the batch number. The batch code used on most of our products are manufacture dates in the Julian Date format. The format is YYDDD, where YY = year, DDD = day. For example, 19200 translates to the 200th day of 2019, or July 19, 2019. This webpage explains and provides charts to help interpret our batch numbers: https://www.techspray.com/batch-codes.

Articles

Preventing PCB Misprints with Optimized Stencil Cleaning Process

Almost 70% of defects in Surface Mount Technology (SMT) are attributed to imperfections in depositing solder paste. Therefore, it becomes imperative to study, improve, and monitor the stencil cleaning process.

Read This Post

Repairing PCBA by Adjusting Solder Reflow Profile & Other Process Improvements

To educate PCB design engineers, this article aims to elaborate how to achieve optimal solder reflow profiles and avoid common Printed Circuit Board Assembly (PCBA) defects, e.g., bridging, tombstoning, beading, and cracking during manufacturing. Some state-of-the-art products of Techspray will be h...

Read This Post

Isopropyl Alcohol (IPA) Replacements for Electronic Assembly and Repair

Isopropyl alcohol, also referred to as IPA, isopropanol, and 2-propanol, may be in short supply for the coming weeks or months because of the COVID-19 (Novel Coronavirus) pandemic. This will be particularly challenging for companies using IPA for flux removal, stencil cleaning, and industrial degrea...

Read This Post

Cleaners Developed to Minimize Global Warming Effect

With global warming in the news and greenhouse gases getting more regulatory attention, electronic and industrial manufacturers are on the look-out for ways to reduce carbon emissions. Techspray has been developing products for over a decade that have much lower Global Warming Potential (GWP), witho...

Read This Post